WAFER PROCESSING APPARATUS HAVING INDEPENDENTLY ROTATABLE WAFER SUPPORT AND PROCESSING DISH

摘要

An apparatus for processing a wafer is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer in a processing position, and to rotate the wafer about a first substantially vertical axis while in the processing position. The processing base includes a shallow dish configured to receive processing chemistry. The wafer support places the wafer in contact with the processing chemistry while in the processing position. The shallow dish is rotatable about a second substantially vertical axis when the wafer support is in the processing position. The rotation of the wafer is independent of the rotation of the shallow dish. Further, the processing base may include a heating element, such as an infrared heating element, that is disposed to locally elevate the temperature of of the shallow dish and chemistry contained in it.

主权项

1. An apparatus for processing a wafer comprising:
a wafer support configured to support a wafer in a processing position, wherein the wafer support is further configured to rotate the wafer about a first substantially vertical axis while in the processing position; and a processing base including a shallow dish configured to receive processing chemistry, wherein the wafer support places the wafer in contact with the processing chemistry in the processing position, wherein the shallow dish is rotatable about a second substantially vertical axis when the wafer support is in the processing position, and wherein the rotation of the wafer is independent of the rotation of the shallow dish.