| 发明名称 |
DIE REPAIRING METHOD AND METHOD FOR MANUFACTURING FUNCTIONAL FILM USING SAME |
| 摘要 |
This is a mold repairing method for removing a resin material deposited on a mold, of which the surface is a porous film with a plurality of recesses that have been created through anodization. The mold repairing method includes the steps of: (I) removing the resin material that is exposed on the surface of the mold over the plurality of recesses without performing atmospheric pressure plasma processing; and (II) removing at least partially the resin material that is still left inside the plurality of recesses by the atmospheric pressure plasma processing, after the step (I) has been performed, thereby recovering the original function of the mold. |
| 申请公布号 |
US2015015961(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201314376982 |
申请日期 |
2013.02.07 |
| 申请人 |
Sharp Kabushiki Kaisha |
发明人 |
Hayashi Hidekazu |
| 分类号 |
B29C33/74;G02B1/11;B29C33/72 |
主分类号 |
B29C33/74 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mold repairing method for removing a resin material deposited on a mold, of which the surface is a porous film with a plurality of recesses that have been created through anodization, the method comprising the steps of:
(I) removing the resin material that is exposed on the surface of the mold over the plurality of recesses without performing atmospheric pressure plasma processing; and (II) removing at least partially the resin material that is still left inside the plurality of recesses by the atmospheric pressure plasma processing, after the step (I) has been performed. |
| 地址 |
Osaka-shi-Osaka JP |
