Modular Electronics Chassis

摘要

An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.

主权项

1. An apparatus for removing a modular electronic device from a chassis, comprising:
a door pivotally coupled to the chassis in front of a chassis enclosure, the chassis enclosure configured to enclose the modular electronic device; a sliding element in slidable engagement with the door, the sliding element configured to move along the door; an ejection actuator disposed in a rear of the chassis enclosure, the ejection actuator including a spring member, wherein the spring member has a first spring member end and a second spring member end, the first spring member end being connected to the ejection actuator, and the second spring member end being connected to the rear of the chassis; and a linkage element having a first linkage element end and a second linkage element end, the linkage element being connected, by the first linkage element end, to the sliding element and connected, by the second linkage element end, to the ejection actuator, wherein the linkage element passes through a point of pivotal coupling of the door to the chassis.