发明名称 TRANSIENT LIQUID PHASE BONDING OF SURFACE COATINGS AND METAL-COVERED MATERIALS
摘要 A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal -plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.
申请公布号 WO2015006439(A1) 申请公布日期 2015.01.15
申请号 WO2014US45936 申请日期 2014.07.09
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 COOK, GRANT, O.
分类号 B23K20/00;B23K1/19 主分类号 B23K20/00
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