发明名称 BONDING STAGE AND METHOD FOR MANUFACTURING SAME
摘要 This bonding stage is provided with: a rigid block (10) wherein a plurality of protrusions (11) are provided on a surface (16) thereof, said protrusions having flat upper surfaces, respectively; a flat board (20) that is fixed on supporting surfaces (18) on the protrusions (11); a ceramic board (30) that is fixed on the flat board (20) by being sucked; a board-like heater (40) that is disposed on the rigid block (10) side of the flat board (20); and a coil spring (50), which is provided between the heater (40) and the rigid block (10), and which has the heater (40) adhered on a flat board (20) surface on the rigid block (10) side.
申请公布号 WO2015004950(A1) 申请公布日期 2015.01.15
申请号 WO2014JP57560 申请日期 2014.03.19
申请人 SHINKAWA LTD. 发明人 WADA, SHOJI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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