Plasma deposition systems and techniques are provided that use plasma generating units having one horizontal dimension at least three times as long as the other horizontal dimension. Plasma sources as disclosed herein thus have non-uniformly scaled dimensions in the x and y directions, to facilitate uniform deposition. Sources as disclosed herein may reduce heating of the substrate due to substrate cooling between plasma sources. They also may provide improved particle coverage when the film deposited is a barrier film due to plasma and gas flow divergence at the edges of the plasma source.
