发明名称 |
EPOXY RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for producing a prepreg capable of reducing the occurrence of a halo without increasing that of resin smear. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent and (C) a curing promoter and contains 1-25 pts.wt. of a synthetic resin to be made into a disperse substance having <=1μm average size in a cured material based on 100 pts.wt. of the total of the components A, B and C when the epoxy resin composition is cured. A phenol novolak resin is contained as the curing agent and the synthetic resin is preferably an acrylonitrile/styrene copolymer resin or an acrylic acid ester polymer resin.
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申请公布号 |
JPH0959345(A) |
申请公布日期 |
1997.03.04 |
申请号 |
JP19950214429 |
申请日期 |
1995.08.23 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
IWAMOTO NARIMASA;MATSUMURA MASAHIRO;NAKAMURA YOSHIHIKO;MOTOBE EIJI;HATSUTA YUKIHIRO |
分类号 |
C08L25/12;C08G59/18;C08L33/04;C08L33/08;C08L59/00;C08L63/00;C08L101/00;H05K1/03;(IPC1-7):C08G59/18 |
主分类号 |
C08L25/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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