发明名称 |
PROJECTION GRAIN, CONDUCTIVE GRAIN, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a projection grain having high flexibility and conductive grains, a conductive material, and a connection structure using the projection grains.SOLUTION: A conductive grain 1 has: a projection grain 11; and a conductive layer 2 arranged on the surface of the projection grain 11. The conductive layer 2 covers the surface of the projection grain 11. The conductive grain 1 is a covered grain in which the surface of the projection grain 11 is covered with the conductive layer 2. The conductive layer 2 has projections 2a along the outer surface. The conductive grain 1 has projections on the conductive surface. The projection grain 11 has a core grain 12 and an inorganic shell 13 arranged on the surface of the core grain 12. The inorganic shell 13 covers the surface of the core grain 12. The conductive layer 2 is arranged on the surface of the inorganic shell 13. The conductive layer 2 covers the surface of the inorganic shell 13. The inorganic shell 13 has projections 13a along the outer surface.</p> |
申请公布号 |
JP2015007224(A) |
申请公布日期 |
2015.01.15 |
申请号 |
JP20140108333 |
申请日期 |
2014.05.26 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
MORITA HIROYUKI;YAMAUCHI HIROSHI;HANEDA SATOSHI |
分类号 |
C08J3/12;C23C18/32;C23C28/00;H01B1/00;H01B1/20;H01B5/00;H01R11/01 |
主分类号 |
C08J3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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