POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATION FILM, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND PRODUCTION METHOD OF POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which allows formation of a positive pattern with high sensitivity and high resolution and which has sufficient resistance to a strong alkali aqueous solution, heat resistance and mechanical characteristics as a cured film when used for such purposes as a surface protective film and an interlayer insulation film.SOLUTION: A positive photosensitive resin composition is provided, comprising an alkali-soluble resin (A), a photoacid generator (B), and a solvent (C). The positive photosensitive resin composition after cured shows a glass transition temperature of 200°C or higher and an inner stress of 40 MPa or less.