MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF

摘要

Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method comprises encapsulating a first semiconductor die having one or more core redistribution layers formed thereover in an outer molded body. The outer molded body has a portion, which circumscribes the core redistribution layer. One or more topside redistribution layers are produced over the core redistribution layer. A contact array is formed over the topside redistribution layer and electrically coupled to the first semiconductor die encapsulated in the outer molded body through the topside redistribution layers and the core redistribution layers.

主权项

1. (canceled)