Electronic Element Packaging Structure and Carrier Substrate Thereof

摘要

The present invention discloses an electronic element packaging structure and a carrier substrate thereof. The electronic element packaging structure includes a heat conduction substrate, which is a vapor chamber having a vacuum cavity thereinside or a heat pipe; a circuit layer disposed on the heat conduction substrate, insulated from the heat conduction substrate, and exposing the upper surface of the heat conduction substrate; at least one chip directly disposed on the upper surface of the heat conduction substrate; an electric connection structure electrically connecting the chip and the circuit layer; and an encapsulant covering the chip and the electric connection structure.

主权项

1. An electronic element packaging structure comprising
a heat conduction substrate, which is a vapor chamber having a vacuum cavity thereinside or a heat pipe; a circuit layer disposed on said heat conduction substrate, insulated from said heat conduction substrate, and exposing an upper surface of said heat conduction substrate; at least one chip directly disposed on said upper surface of said heat conduction substrate; an electric connection structure electrically connecting said chip and said circuit layer; and an encapsulant covering said chip and said electric connection structure.