发明名称 COMPOSITION FOR FORMING SILVER ION DIFFUSION-SUPPRESSING LAYER, FILM FOR SILVER ION DIFFUSION-SUPPRESSING LAYER, CIRCUIT BOARD, ELECTRONIC DEVICE, CONDUCTIVE FILM LAMINATE, AND TOUCH PANEL
摘要 A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.
申请公布号 US2015014030(A1) 申请公布日期 2015.01.15
申请号 US201414467680 申请日期 2014.08.25
申请人 FUJIFILM Corporation 发明人 MITAMURA Yasuhiro;NAKAYAMA Masaya;MATSUNAMI Yuki
分类号 H05K1/02;H05K1/09;H01B3/44 主分类号 H05K1/02
代理机构 代理人
主权项 1. A composition for forming a silver ion diffusion-suppressing layer, comprising: an insulating resin; and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with a total number of carbon atoms in the at least one hydrocarbon group being 5 or more.
地址 Tokyo JP