发明名称 |
COMPOSITION FOR FORMING SILVER ION DIFFUSION-SUPPRESSING LAYER, FILM FOR SILVER ION DIFFUSION-SUPPRESSING LAYER, CIRCUIT BOARD, ELECTRONIC DEVICE, CONDUCTIVE FILM LAMINATE, AND TOUCH PANEL |
摘要 |
A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects. |
申请公布号 |
US2015014030(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
US201414467680 |
申请日期 |
2014.08.25 |
申请人 |
FUJIFILM Corporation |
发明人 |
MITAMURA Yasuhiro;NAKAYAMA Masaya;MATSUNAMI Yuki |
分类号 |
H05K1/02;H05K1/09;H01B3/44 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A composition for forming a silver ion diffusion-suppressing layer, comprising:
an insulating resin; and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with a total number of carbon atoms in the at least one hydrocarbon group being 5 or more. |
地址 |
Tokyo JP |