发明名称 PRINTED CIRCUIT BOARD PREPARATION METHOD AND PRINTED CIRCUIT BOARD
摘要 <p>The present invention belongs to the technical field of electronic product production, and provides a PCB preparation method, comprising the following steps: obtaining a substrate and drilling; sandblasting for a first time; depositing copper on an outer layer, and electroplating on a full plate; electroplating matte copper; sandblasting for a second time; conducting a pattern transfer operation; stripping; etching; and resistance welding and silk screening. Also provided is a printed circuit board prepared by using the preparation method of the present invention.</p>
申请公布号 WO2015003369(A1) 申请公布日期 2015.01.15
申请号 WO2013CN79234 申请日期 2013.07.11
申请人 SHENZHEN SUNTAK MULTILAYER PCB CO., LTD. 发明人 OU, ZHIFU;JIANG, XUEFEI;SONG, JIANYUAN
分类号 H05K3/00 主分类号 H05K3/00
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