发明名称 |
PRINTED CIRCUIT BOARD PREPARATION METHOD AND PRINTED CIRCUIT BOARD |
摘要 |
<p>The present invention belongs to the technical field of electronic product production, and provides a PCB preparation method, comprising the following steps: obtaining a substrate and drilling; sandblasting for a first time; depositing copper on an outer layer, and electroplating on a full plate; electroplating matte copper; sandblasting for a second time; conducting a pattern transfer operation; stripping; etching; and resistance welding and silk screening. Also provided is a printed circuit board prepared by using the preparation method of the present invention.</p> |
申请公布号 |
WO2015003369(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
WO2013CN79234 |
申请日期 |
2013.07.11 |
申请人 |
SHENZHEN SUNTAK MULTILAYER PCB CO., LTD. |
发明人 |
OU, ZHIFU;JIANG, XUEFEI;SONG, JIANYUAN |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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