| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method and a mounting structure of an electronic component which securely and easily mount an electronic component on a die pad of a circuit board without causing gaps. <P>SOLUTION: A semiconductor chip 21 is placed on a die pad 11 inclining a joining surface 21a of the semiconductor chip 21 relative to one surface 11a of the die pad 11 so that only a part of the joining surface 21a of the semiconductor chip 21 contacts with a solder chip 13 (an electronic component placement process). In this structure, the semiconductor chip 21 inclines so that, for example, one of four corners runs on the solder chip 13. At the same time, the semiconductor chip 21 inclines so that one end (end part), which excludes a portion contacting with the solder chip 13, contacts with the one surface 11a of the die pad 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
