MULTI-CHIP MODULE AND CHIP CARRIER THEREOF

摘要

PROBLEM TO BE SOLVED: To keep a cover stable in potential so as to make a multi-module stable in performance by a method wherein the grounding electrode of a chip carrier is connected to the cover of the module. SOLUTION: The grounding electrode 5 of a chip carrier 1 is extended upwards and provided with an upside plated with solder, whereby a cover 4 and a heat sink (heat dissipating plate) 3 are electrically connected together with the chip carrier 1 when a multi-chip module is assembled. A space inside the module is separated into two by the metal part of the chip carrier 1 connected to its grounding electrode 5, whereby inner circuits inside the module can be improved in isolation.