发明名称 ALIGNER AND EXPOSURE METHOD
摘要 PROBLEM TO BE SOLVED: To improve overlay precision of exposure patterns, by correcting system error in a shot which depends on a wafer stage position in an optical system demagnification pojecting aligner. SOLUTION: In this aligner, a circuit pattern drawn on a reticle 6 mounted on a reticle stage 10a is projected on a semiconductor wafer 4 mounted on a wafer stage 5a, and shots are formed. At this time, the rotation errorθfor each shot which is formed on the wafer 4 is detected, and is approximated by a functionθs (x, y) of n-degree, in the wafer surface coordinates (x, y). Control is so performed that the rotation position in a stage surface of at least one out of the reticle stage 10a and the wafer stage 5a is set in accordance with the functionθs (x, y).
申请公布号 JPH09260250(A) 申请公布日期 1997.10.03
申请号 JP19960066439 申请日期 1996.03.22
申请人 TOSHIBA CORP 发明人 TOUKI TATSUHIKO;ASANUMA KEITA
分类号 G03F7/20;G03F9/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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