| 摘要 |
<p>Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer comprising a polyvinyl acetal resin, a cationic polymerizing resin, a cationic polymerization initiator and conductive particles, and a second adhesive layer comprising a cationic polymerizing resin and a cationic polymerization initiator are laminated. A high conductive particle capture efficiency is thereby obtained even when fixed by applying pressure at a low temperature and low temperature curability is improved.</p> |
