| 摘要 |
<p>Provided is an apparatus for molding semiconductor devices, which is capable of constantly maintaining an air vent area. An apparatus for molding semiconductor devices according to the present invention includes an upper mold and a lower mold. The upper mold includes an upper cavity block having an upper cavity for molding the semiconductor devices and an air vent connected to the upper cavity to exhaust air in the upper cavity; an air vent maintaining member mounted on the upper cavity block in a vertical direction to divide the air vent into two regions and having a channel connecting the divided air vent areas to each other; and an elastic member for applying elastic restoring force downwardly to the air vent maintaining member. Thus, an area of the air vent may be always maintained constantly by the channel.</p> |
