| 摘要 |
PROBLEM TO BE SOLVED: To suppress the diffusion of particles in a chamber by preventing the release of deposits on a deposition-preventing plate in sputtering, even if the stress due to expansion and shrinkage is applied. SOLUTION: The upper surface side 17a facing a target of a lower deposition-preventing plate 17 has a flat surface 31 at a portion from an inner circumferential edge 17c which is a position close to a stage 13 to at least a position which overlaps with the lower end 16E of an upper deposition-preventing plate. The flat surface 31 may be an inclined plane which extends toward an inner circumferential surface (side wall) 11a of a chamber 11 from the inner circumferential edge 17c, for example, with an angleθof the flat surface 31 to the horizontal plane in the range of 5°to 20°. COPYRIGHT: (C)2013,JPO&INPIT |
