| 摘要 |
<p>The purpose of the present invention is to provide a copper foil for lamination, said copper foil exhibiting excellent adhesion to a substrate and being capable of forming a high-precision wiring pattern. This copper foil for lamination is a copper foil to be laminated on a substrate, wherein the surface roughness (Rz) on the side to be faced to the substrate is 0.500mum or less, and the fractal dimension of a cross-sectional profile on the side to be faced to the substrate is 1.020 to 1.400 as calculated by applying a box counting method wherein the side length of the square boxes is set to 1 to 10nm.</p> |
