| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the reliability with respect to the package crack and separation problem by using a Cu alloy lead frame, in a plastic semiconductor package. SOLUTION: A plastic semiconductor package has a semiconductor chip 2 adhered to a die pad 3 on a lead frame L, having a surface oxide film and leads 4 connected to the chip through bonding wires 5, all being encapsulated with a resin mold 1 in one body. The lead frame is made of a Cu alloy, contg. Cr 0.05-O.4%, Zr 0.03-O.25% and Zn 0.06-2.0%, and if required Fe 0.1-1.8%r Ti 0.1-O.8% and/or at least one of Ni, Sn, In, Mn, P, Mg, and Si 0.01-1.0%, to thereby improve the adhesion to the lead frame mother material of the oxide film.</p> |
