发明名称 VERTICAL TYPE WAFER-TREATING TOOL
摘要 <p>PROBLEM TO BE SOLVED: To provide a vertical-type wafer-treating tool for facilitating manufacture and handling by suppressing a crystal defect generated in a heat-treated wafer, and enhancing uniformity in a fluid such as atmosphere gas and a temperature and hence improving practicality and simplifying the shape. SOLUTION: In a vertical type wafer-treating tool where a plurality of posts are installed between a top 14 and a bottom plate 16, a plurality of grooves 20 for placing and fitting a wafer W are formed on the outer peripheral surface of the posts, and a plurality of wafers are retained at the groove for heat treatment, the posts are in cylindrical body where the inside is hollow and the groove is provided so that the outer periphery surface of the side wall of cylindrical posts 18 is penetrated to the inside hollow part.</p>
申请公布号 JPH10163121(A) 申请公布日期 1998.06.19
申请号 JP19960319915 申请日期 1996.11.29
申请人 FUKUI SHINETSU SEKIEI:KK;SHINETSU QUARTZ PROD CO LTD;TOKYO ELECTRON LTD 发明人 NAKAMURA SHINICHI;MUNECHIKA TAKAAKI;KIMURA HIROSHI;NISHIMURA KAZUAKI
分类号 H01L21/683;H01L21/205;H01L21/22;H01L21/31;H01L21/324;H01L21/68;(IPC1-7):H01L21/22 主分类号 H01L21/683
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