EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE

摘要

Electronic assemblies including substrates and their manufacture are described. One assembly includes a die embedded in a dielectric layer in a multilayer substrate, and a dielectric region embedded in the dielectric layer in the multilayer substrate. The multilayer substrate includes a die side and a land side, with the first dielectric region and the dielectric layer extending to the die side. A plurality of vias are positioned within the first dielectric region, the vias extending to pads on the die side. Other embodiments are described and claimed.

主权项

1. A method comprising:
providing a coreless carrier; forming a plurality of metal pad regions on the coreless carrier; forming a first dielectric layer on the coreless carrier and on the metal pad regions; patterning the first dielectric layer to form a dielectric region that covers the metal pad regions and to form a cavity that exposes the coreless carrier, the cavity sized to accept a die; positioning a die in the cavity; forming openings through the dielectric region to expose a surface of the metal pad regions; depositing a metal in the openings; and forming a second dielectric layer on the die and on the dielectric region, so that the die and the dielectric region are embedded in the second dielectric layer.