| 摘要 |
Disclosed are a non-shrink varistor substrate and a method of manufacturing the same, wherein the non-shrink varistor substrate includes: a reinforcement layer formed of a ceramic material; a thin bonding layer formed on the surface of the reinforcement layer; a first varistor layer formed on the thin bonding layer and including a plurality of inner electrode layers therein; and an outer electrode layer formed on the first varistor layer and electrically connected to the inner electrode layers by a conductive material loaded in a via hole formed through the first varistor layer, the thin bonding layer and the reinforcement layer, and also wherein bondability and bonding reliability can be enhanced upon heterobonding of the reinforcement layer and the varistor layer. |
