| 摘要 |
<p>In an embodiment of the present invention, a plasma processing device is able to cool dielectric windows of the plasma processing device by including the dielectric windows, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposure surface and an air exposure surface. The vacuum chamber and the plasma exposure surface of the dielectric window are able to cooperate in order to enclose plasma processing gas. The energy source is able to form a high temperature area in the dielectric window by delivering electromagnetic energy through the dielectric window. At least one air amplifier is able to be connected with the dielectric window through fluid. At least one air amplifier is able to operate at a back pressure of at least 1 in-H_2O and is able to provide at least 30 cfm of air.</p> |
