| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in adhesiveness, heat resistance, moisture resistance, flame retardancy, dielectric property and the like, and particularly having a characteristic such that the warpage amount of the substrate thereof when heated is extremely small; and to provide a prepreg using the composition and also a laminate using the prepreg. <P>SOLUTION: The thermosetting resin composition contains a setting agent (A) having the N-substituted maleimide groups and acidic substituent, produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amino compound (b) having the acidic substituent represented by general formula (I), and a bisphenol F type phenol novolac epoxy resin (B) (wherein R<SB POS="POST">1</SB>s are each independently hydroxyl being an acidic substituent, carboxyl or sulfonic acid; R<SB POS="POST">2</SB>s are each independently 1-5C aliphatic hydrocarbon or halogen; and x is an integer of 1 to 5, y is an integer of 0 to 4 and x+y=5). The invention further provides a prepreg using the composition and a laminate using the prepreg. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
