发明名称 POLISHING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide highly clean products by suppressing the increase of facilities and running costs, and preventing mutual pollution at each step. SOLUTION: In a polishing equipment providing polishing units 10a and 10b. For chemically and mechanically polishing the surface of materials to be polished, cleaning units 26a, 26b and 26c for cleaning the polished materials, and transfer units 20a and 20b for transferring the materials to be polished between the units 26a, 26b and 26c, a space housing each unit are partitioned according to the degree of cleanliness for constructing a plurality of chambers R1 to R4 , and a transfer gate 18, having temporary chambers 18a and 18b for temporarily storing the materials to be polished are provided between the chambers.
申请公布号 JPH10340870(A) 申请公布日期 1998.12.22
申请号 JP19970165152 申请日期 1997.06.06
申请人 EBARA CORP;TOSHIBA CORP 发明人 AIZAWA HIDEO;ITO KENYA;YAJIMA HIROMI;SHIGETA KENICHI;TATEYAMA YOSHIKUNI
分类号 H01L21/677;H01L21/304;H01L21/68;(IPC1-7):H01L21/304 主分类号 H01L21/677
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