发明名称 RESIST PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To form a resist pattern superior in dimensional uniformity by using a reticule with dispersion in the pattern. SOLUTION: A positive resist 13 is formed on base bodies 11 and 12, a prescribed region of the resist 13 is photosensed by using the reticule for which dimensional fluctuation is present in an opening part, and the dissolving part and remaining part of the resist 13 are defined. Then, development is performed in a time for which not all the dissolving part defined largest for a design dimension among the defined dissolving part of the resist 13 is developed. Next, a development adjustment film 14 which is soluble in a developer and slower than the dissolving speed of the resist 13 is formed on the resist 13, the development of the development adjustment film 14 and the resist 13 is performed, and a resist pattern is formed.
申请公布号 JPH10340838(A) 申请公布日期 1998.12.22
申请号 JP19970149155 申请日期 1997.06.06
申请人 TOSHIBA CORP 发明人 ASANO MASASHI;SHIOBARA HIDESHI
分类号 G03F7/30;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/30
代理机构 代理人
主权项
地址