| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a facedown junction by expanding the bump surface area on a printed wiring board for increasing the transfer, by a method wherein, after the formation of a bump on an electrode of a bare chip, the bump front end processing and after bump processing transferring a conductive paste are simultaneously performed. SOLUTION: After the formation of a bump 2 on an electrode of a bare chip 1, in order to increase the contact area of the surface area of the bump 2 on the electrode with a printed wiring board, a front end 3 of the bump 2 is made to abut against a high flatness board 6 coated with a conductive paste 5 for bending process simultaneously transferring the conductive paste. Through these procedures, the front ends 3 of the bumps 2 of the whole bare chips can be collectively bent to increase the transfer amount of the conductive paste 5, thereby enabling the shortage and dispersion of the transfer amount to be reduced, so that the facedown junction may be performed on a printed wiring board 7 using the bumps 2.</p> |
