发明名称 |
Heat radiation plate and submarine apparatus |
摘要 |
<p>A heat radiation plate includes a depressed portion into which thermally-conductive resin that transfers heat of an electronic component to the heat radiation plate is poured, and a plurality of check portions configured to be provided to the depressed portion and with an upper surface portion and a lower surface portion stepwise at positions lower than an outer edge portion of the depressed portion and higher than a bottom surface portion of the depressed portion so that a liquid level of the thermally-conductive resin is visually checkable, wherein when the thermally-conductive resin is normally filled in the depressed portion, each of the lower surface portions of the plurality of check portions is covered with the thermally-conductive resin and each of the upper surface portions of the plurality of check portions is exposed without being covered with the thermally-conductive resin.</p> |
申请公布号 |
EP2824702(A1) |
申请公布日期 |
2015.01.14 |
申请号 |
EP20140169976 |
申请日期 |
2014.05.27 |
申请人 |
FUJITSU LIMITED |
发明人 |
YOSHIZUMI, TAKAHISA;HOSHIYAMA, NAOTO |
分类号 |
H01L23/24;H01L21/56;H01L23/367;H01L23/373;H01L23/40;H01L23/42;H05K1/02;H05K3/00;H05K3/28;H05K7/20 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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