发明名称 放熱マット
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation mat in a simple device structure, which is installed at low cost and is trouble-free in maintenance. <P>SOLUTION: Hot water from a heat source device 20 is flown to: a plumbing pipe 6A in a setting area which is placed in a setting area of a mat material 12 via a header 1; and plumbing pipes 6B and 6C outside a setting area, which are placed in an area other than the setting area. When a temperature of hot water made to flow to pipes 6 (6A, 6B and 6C) side from a header 1 side is a predetermined set temperature or more, a temperature-corresponding open/close valve in the header 1 opens, and the hot water is flown to a whole area of a mat body by making the hot water flow to both the plumbing pipe 6A in the setting area and the plumbing pipes 6B and 6C outside the setting area. When the temperature of the hot water flowing from the header 1 side to the pipe 6 side is lower than the set temperature, the temperature-corresponding open/close valve is closed, and a flow of the hot water to the sides of the plumbing pipes 6B and 6C outside the setting area is stopped, and the hot water is flown to only the setting area. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5651370(B2) 申请公布日期 2015.01.14
申请号 JP20100094203 申请日期 2010.04.15
申请人 发明人
分类号 F24D3/00 主分类号 F24D3/00
代理机构 代理人
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