| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prepreg for heat- and pressure-molding, which can provide, when applied to an interlayer adhesive layer in multilayering of a printed wiring board, an insulating layer having satisfactory circuit filling properties and heat conductivity. <P>SOLUTION: The prepreg for heat- and pressure-molding is obtained by semi-curing a thermosetting resin composition including an inorganic filler in a sheet shape. The inorganic filler comprises at least two components including the following (1) and (2). (1) A filler composed of an aggregate of primary particles, the average particle size d1 of the aggregate being in the range of 10μm≤d1≤70μm. (2) A filler having a particulate shape, the average particle size d2 of each particle being in the range of 0.1μm≤d2≤30μm. The thermosetting resin composition has a total content of the inorganic filler of 20-80% by volume, in which 5-40% by volume of the component (1) and 10-50% by volume of the component (2) are added to a volume of the thermosetting resin solid and the inorganic filler. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
