CIRCUIT CONNECTION MATERIAL, CIRCUIT CONNECTION STRUCTURE, ADHESIVE FILM, AND WOUND BODY

摘要

A circuit connection material for electrically connecting two circuit members facing each other, which contains a thermoplastic resin, radically polymerizable compounds, a radical polymerization initiator and inorganic fine particles. The content of the radically polymerizable compounds is 40% by mass or more based on the total amount of the circuit connection material, and the content of compounds having a molecular weight of 1,000 or less among the radically polymerizable compounds is 15% by mass or less based on the total amount of the circuit connection material. The content of the inorganic fine particles is 5-30% by mass based on the total amount of the circuit connection material. The circuit connection material contains at least a compound represented by formula (1).