发明名称 積層体
摘要 <p>Disclosed are: a curable resin composition which can fix surface materials to each other satisfactorily in the lamination/integration of the surface materials through a resin layer comprising a cured product of the curable resin composition, and which can reduce a stress caused by the shrinkage of the resin layer upon curing; and a laminate produced by laminating surface materials on each other using the curable resin composition. Specifically disclosed is a curable resin composition which can be used in a laminate that is formed by sandwiching an uncured form of the curable resin composition between a pair of surface materials (wherein at least one of the surface materials is transparent) and curing the sandwiched product, and which is characterized by having a storage shear elastic modulus of 5×102 to 1×105 Pa as measured by a dynamic viscoelasticity after curing and a loss tangent of 1.4 or less.</p>
申请公布号 JP5652506(B2) 申请公布日期 2015.01.14
申请号 JP20130121215 申请日期 2013.06.07
申请人 发明人
分类号 B32B27/00;B32B7/02;B32B27/30;C08F290/06 主分类号 B32B27/00
代理机构 代理人
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