| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the wiring bonding with pads arranged in the neighborhood of the corner part of a chip can be attained easily, and the sharing of a probe to be used for evaluation or the like can be attained. SOLUTION: Pads 4a-4k for input and output signals are arranged by the first pitch at the peripheral part other than the corner part of a chip 2, and pads 4a, 4c and 4e for input and output signals and pads 4b, 4d and 4f especially for a power source are arranged at the corner part of the chip 2. In this case, the pads 4a, 4c and 4e for input and output signals and the pads 4b, 4d and 4f especially for the power source are arranged alternately with the first pitch, and the positions of the pads 4b, 4d and 4f especially for the power source are fixed. Thus, the pads 4a, 4c, and 4e for input and output signals are arranged with a wider pitch than for the first pitch.</p> |
