| 摘要 |
A mold release processing method for a mold (1) includes: preparing a mold release processing substrate (5) coated with a mold release agent (6); causing a mold main body (12) having adsorbed water (2) on the surface thereof and the mold release processing substrate (5) to approach each other until a contact state in which the upper portions of protrusions of pattern (13) of protrusions and recesses are in contact with the mold release agent (6); maintaining the contact state until mold release layer (14), having a thickness distribution in which the thickness of the mold release layer (14) at the side surface (Ss) of the pattern (13) of protrusions and recesses becomes thinner from the top of surfaces (St) of the protrusions toward the bottom surfaces (Sb) of the recesses due to the mold release agent (6) becoming diffused in the adsorbed water (2), is formed; and causing the mold main body (12) and the mold release processing substrate (5) to move away from each other such that the upper portions of the protrusions separate from the mold release agent (6) on the mold release processing substrate (5). |
