| 摘要 |
<p>A method of producing a flexible substrate which grows a metal bump (16) by using a mask film patterned by a photolithography process. When an opening is formed in a polyimide film without using a laser beam, a fine opening can be formed accurately thus enabling a fine metal bump (16) to be formed accurately. After the metal bump (16) is formed, the mask film is removed, a liquid resin material is applied before drying to form a coat and the coat is cured to form a resin film. The tip end of the metal bump (16) can be exposed if the surface is etched during the coat forming process.</p> |
