| 摘要 |
<p>PURPOSE: A semiconductor package is provided to improve an antenna property and/or an electrostatic discharge property by including a conductive network to comprise an antenna and an electrostatic discharge unit at the same. CONSTITUTION: A semiconductor chip(110) is arranged on a main substrate and is electrically connected. A semiconductor element is embedded in the semiconductor chip. A conductive network(150) is formed on the rear side of the semiconductor chip. The semiconductor chip is arranged to make the front side of the semiconductor chip face the main substrate. A conductive plug is connected to the conductive network and passes through the semiconductor chip.</p> |
