发明名称 |
Copper paste and wiring board using the same |
摘要 |
<p>A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor (3), the copper paste comprising a copper powder (5), an organic vehicle and at least one (7) selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe 2 O 3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.</p> |
申请公布号 |
EP2343956(B1) |
申请公布日期 |
2015.01.14 |
申请号 |
EP20110002005 |
申请日期 |
2003.07.17 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
SUMI, HIROSHI;MITZUTANI, HIDETOSHI;SATO, MANABU |
分类号 |
H05K1/09;H05K1/11;H01L23/498;H05K3/40;H05K3/46 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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