| 摘要 |
<p>The present invention relates to a light emitting device and a light emitting device package. The light emitting device includes a substrate; a light emitting structure which is formed at the center region of the first surface of the substrate and includes a first semiconductor layer, an active layer, and a second semiconductor layer; a first electrode which is electrically connected to the first semiconductor layer; and a second electrode which is electrically connected to the second semiconductor layer. The first electrode and the second electrode penetrate the substrate in the thickness direction of the substrate to expose the second surface of the substrate.</p> |
