| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy compound hardly causing internal rearrangement of a C-C double bond in hydrosilylation reaction nor reductive reaction of the ester part, and to provide a curable composition giving cured products excellent in transparency, heat-resistance and gas barrier property. SOLUTION: An epoxy compound represented by general formula (1) is provided. (R<SP POS="POST">1</SP>-R<SP POS="POST">9</SP>represent each independently H or a 1-4C alkyl; and n is an integer of 0-4). Further, a curable composition comprising an epoxy group-containing silicone product obtained by hydrosilylation reaction of the epoxy compound with a linear or cyclic silicone compound containing in the molecule two or more Si-H groups formed by combining different Si atoms with a hydrogen atom is provided. COPYRIGHT: (C)2012,JPO&INPIT |
