| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for bonding a semiconductor which has high transparency and high bonding reliability, an adhesive film for bonding the semiconductor manufactured by using the adhesive for bonding the semiconductor, a method for mounting a semiconductor chip using the adhesive for bonding the semiconductor, and a semiconductor device manufactured by using the method for mounting the semiconductor chip. <P>SOLUTION: An adhesive for bonding the semiconductor comprises: a epoxy resin; a high polymer having a functional group reacting with the epoxy resin; a curing agent; and a stress reliever. The stress reliever comprising a core layer composed of rubber component and a shell layer composed of acrylic resin is a core shell grain having an average particle size of 0.1 to 2μm, and the content of the stress reliever is 1 to 20 wt%. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
