SOI WAFER HAVING CYLINDRICAL BEARING, AND MANUFACTURING METHOD THEREOF

摘要

Disclosed are an SOI wafer including a roller bearing and a method of manufacturing the same. The method of manufacturing an SOI wafer (S100) according to an embodiment of the present invention includes the steps of: a) forming a groove in which a roller bearing can move on a bottom plate of the SOI wafer (S110); b) positioning the roller bearing in the groove (S120); c) compressing the roller bearing by attaching an upper plate including an insulator layer formed at a lower surface thereof to an upper portion of the bottom plate (S130); d) restoring the roller bearing to an original state by removing the insulator layer (S140). The method of manufacturing an SOI wafer according to the present invention may obtain a significantly improved process efficiency as compared with the relate art by omitting a process of mounting a bearing at an inside by separating the upper plate from the bottom plate.