发明名称 Wiring board
摘要 A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
申请公布号 US8933556(B2) 申请公布日期 2015.01.13
申请号 US201012895126 申请日期 2010.09.30
申请人 Ibiden Co., Ltd. 发明人 Naganuma Nobuyuki;Takahashi Michimasa;Aoyama Masakazu
分类号 H01L23/053;H01L23/12;H05K1/11;H05K3/46;H05K3/40 主分类号 H01L23/053
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A wiring board, comprising: a laminated body having a first surface and a second surface on an opposite side of the first surface, the laminated body comprising a first insulation layer, a second insulation layer and a third insulation layer in an order of the first insulation layer, the second insulation layer and the third insulation layer from the first surface of the laminated body toward the second surface of the laminated body; and an interlayer insulation layer laminated on the first surface of the laminated body, wherein the first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor comprising a plating formed in the first hole in the first insulation layer, the second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor comprising a conductive paste filled in the second hole of the second insulation layer, the third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor comprising a plating formed in the third hole in the third insulation layer, the first conductor, the second conductor and the third conductor are positioned along a same axis and are electrically continuous with each other, the first conductor has a land portion connected to the second conductor and formed on a surface of the first insulation layer such that the land portion of the first conductor is embedded in the second insulation layer, the third conductor has a land portion connected to the second conductor and formed on a surface of the third insulation layer such that the land portion of the third conductor is embedded in the second insulation layer, and the first insulation layer, the second insulation layer and the third insulation layer have thicknesses which are set greater than the thickness of the interlayer insulation layer.
地址 Ogaki-shi JP