发明名称 Method of fabricating diamond semiconductor and diamond semiconductor formed according to the method
摘要 Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond semiconductor material having a surface, exposing the surface to a source gas in an etching chamber, forming a carbide interface contact layer on the surface; and forming a metal layer on the interface layer.
申请公布号 US8933462(B2) 申请公布日期 2015.01.13
申请号 US201213725978 申请日期 2012.12.21
申请人 AKHAN Semiconductor, Inc. 发明人 Khan Adam
分类号 H01L29/15;H01L21/768;H01L29/16;H01L21/04;H01L29/66;H01L29/868 主分类号 H01L29/15
代理机构 代理人 Thompson Lawrence E.;Kostopoulos Kostas;Jerisat Martin
主权项 1. A method of fabricating diamond semiconductor, the method including the steps of: selecting a diamond semiconductor material having a surface; exposing the surface to a source gas in an etching chamber; forming a carbide interface contact layer on the surface; and forming a metal layer on the carbide interface contact layer.
地址 Hoffman Estates IL US