发明名称 COMPOSITION FOR FORMING FILM AND MATERIAL FOR FORMING INSULATING FILM
摘要 PROBLEM TO BE SOLVED: To obtain a composition for forming a film having excellent dielectric constant and water absorption ratio as interlayer dielectrics, capable of forming a opacified coating film having a proper uniform thickness. SOLUTION: This composition for a film comprises (A) a hydrolyzate and a condensate or either one of the hydrolyzate and condensate of at least one compound selected from (A-1) a compound of general formula (1) R1aSi(OR2)4-a (R1 is a hydrogen atom, a fluorine atom, a monofunctional organic group; R2 is a monofunctional organic group; (a) is an integer of 0-2) and (A-2) a compound of general formula (2) R3b(R4O)3-bSi-(R7)d-Si(OR5)3-cR6c (R3, R4, R5 and R6 are each the same or different and a monofunctional organic group; b and c are the same or different and a number of 0-2; R7 is an oxygen atom or (CH2)n; d is 0 or 1; n is an integert of 1-6) and (B) a fluorine-based surfactant.
申请公布号 JP2000336314(A) 申请公布日期 2000.12.05
申请号 JP19990150984 申请日期 1999.05.31
申请人 JSR CORP 发明人 NISHIKAWA MICHINORI;SUGIURA MAKOTO;HAYASHI EIJI;KUROSAWA TAKAHIKO;YAMADA KINJI
分类号 H01L21/312;C09D183/06;C09D183/14;H01L21/316;(IPC1-7):C09D183/06 主分类号 H01L21/312
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