发明名称 Phenolic polymers and photoresists comprising same
摘要 The present invention relates to new polymers that contain phenolic groups spaced from a polymer backbone and photoacid-labile group. Preferred polymers of the invention are useful as a component of chemically-amplified positive-acting resists.
申请公布号 US8932793(B2) 申请公布日期 2015.01.13
申请号 US200812075726 申请日期 2008.03.12
申请人 Rohm and Haas Electronic Materials LLC 发明人 Cameron James F.
分类号 G03F7/004;G03F7/40 主分类号 G03F7/004
代理机构 Edwards Wildman Palmer LLP 代理人 Edwards Wildman Palmer LLP ;Corless Peter F.
主权项 1. A method of forming a positive photoresist relief image, comprising: (a) applying on a substrate a layer of a photoresist comprising a photoactive component and a resin, the resin comprises a structure of the following formula wherein each Z is the same or different bridge unit; X comprises one or more alkyl, oxygen or sulfur atoms; each R1 is the same or different non-hydrogen substituent; and m is an integer of from zero to 4; AL is a moiety that comprises a photoacid-labile group; Y is a moiety that is distinct from the spaced phenolic group or moiety that comprises AL, and Y is selected from the group consisting of phenyl; phenyl substituted with halogen, cyano, alkyl or alkoxy; and an ester that does not undergo a photoacid-indueed cleavage reaction during exposing and developing of the photoresist layer; a, b and c are mole percents of the respective polymer units based on total repeat units in the polymer and a, b and c are each greater than zero; and (b) exposing and developing the photoresist layer to yield a relief image.
地址 Marlborough MA US