发明名称 METHODS FOR MEASURING THICKNESS OF OBJECT
摘要 <p>A method for measuring the thickness of an object is provided. The measuring method comprises: a step of measuring first X-ray reflectivity of a substrate before an object is formed on the substrate; a step of forming the object on the substrate; a step of measuring a second X-ray reflectivity of the substrate after the object is formed; a step of calculating a change amount between the first X-ray reflectivity and the second X-ray reflectivity; and a step of performing fast Fourier transform (FFT) on the calculated change amount.</p>
申请公布号 KR20150004602(A) 申请公布日期 2015.01.13
申请号 KR20130077780 申请日期 2013.07.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, BYUNG HYUN;KIM, KWANG HOON;SON, WOONG KYU;SONG, CHUL GI;LEEM, CHOON SHIK
分类号 G01B15/02;G01N23/20;H01L21/66 主分类号 G01B15/02
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