| 摘要 |
<p>PURPOSE: A laser processing method of a semiconductor package is provided to prevent the interface between adjacent holes due to thermal stress which is generated in a laser processing by forming holes over two pitches in oblique direction and row and column direction. CONSTITUTION: In a laser processing method of a semiconductor package, a plurality of holes(20) are formed in a first hole row by projecting laser beam by 2 pitches. A plurality of holes are formed in a second hole row by projecting laser beam by 2 pitches. Laser is projected between holes in the first hole to form holes by 2 pitches. Laser is projected between holes in the second hole to form holes by 2 pitches.</p> |
