发明名称 Method for manufacturing LED with transparent ceramics
摘要 A method for manufacturing an LED (light emitting diode) with transparent ceramic is provided, which includes: adding quantitative fluorescent powder into transparent ceramic powder, wherein the doped ratio of the fluorescent powder is 0.01-100 wt %; preparing the fluorescent transparent ceramic using ceramic apparatus and process, after fully mixing the raw material; assembling the prepared fluorescent transparent ceramic and a semiconductor chip to form the LED device. The method assembles the fluorescent transparent ceramic and a semiconductor chip to form the LED device by replacing the fluorescent powder layer and the epoxy resin package casting of the traditional LED with fluorescent transparent ceramic. The fluorescent transparent ceramic is used as the package cast and fluorescent material, and the LED device manufactured through the method has more excellent performance.
申请公布号 US8932887(B2) 申请公布日期 2015.01.13
申请号 US201013497824 申请日期 2010.09.29
申请人 Bright Crystals Technology, Inc. 发明人 Lei Muyun;Li Zhen;Lou Zailiang;Zhao Yanmin;Song Qinghai;Yang Yongliang
分类号 H01L21/00;H01L33/50;C04B35/443;C04B35/645;C09K11/02;C09K11/77;H01L33/48 主分类号 H01L21/00
代理机构 AKC Patents LLC 代理人 AKC Patents LLC ;Collins Aliki K.
主权项 1. A method for manufacturing an LED (light-emitting diode) with transparent ceramic, comprising the following specific steps: 1) adding quantitative fluorescent powder into non-fluorescent transparent ceramic powder, wherein a doped ratio of the fluorescent powder to the non-fluorescent transparent ceramic powder is 0.01-7 wt % or using a fluorescent transparent ceramic powder made of 100 wt % fluorescent powder; 2) fully mixing said fluorescent powder and said non-fluoresent transparent ceramic powder and preparing a fluorescent transparent ceramic or preparing a fluorescent transparent ceramic using 100 wt % fluorescent powder via ceramic preparation processes; 3) performing cutting and pretreatments on the fluorescent transparent ceramic so as to process the fluorescent transparent ceramic into a required shape and size of a device; 4) assembling the fluorescent transparent ceramic and a semiconductor chip to form an LED device; and wherein said transparent ceramic powder in step 1) is one of magnesium aluminate spinel, yttrium aluminum garnet, yttrium oxide, aluminum oxynitride, zinc sulfide, zirconium oxide, yttrium lanthanum oxide, strontium chromate, magnesium oxide, beryllium oxide, yttrium oxide-zirconium, dioxide,gallium arsenide, zinc sulfide, zinc selenide, magnesium fluoride, calcium fluoride, scandium oxide, lutetium oxide or gadolinium oxide.
地址 Beijing CN